August 2004

Chicago Area Events October 4-8: Attend One, Two, or All Three
   • Monday, October 4 – ISTA presents an all-day tutorial titled Dock-to-Door: Limiting Parcel Package        Transit Damage at the Parcel Shipping and Distribution Forum
   • Tuesday, October 5 – ISTA Certified Packaging Laboratory Professional (CPLP) Workshop
     for Technician-level certification
   • Wednesday, October 6 – CPLP Workshop for Technologist-level certification
   • Thursday, October 7 – ISTA Fall Technical Committee Meeting

These are all individual events, but held in close proximity to each other. It may be efficient and economical for you to combine attendance at two or all three.

The Parcel Shipping and Distribution Forum is designed to help mid- to high-volume parcel shippers create a more efficient order entry, warehousing, picking, packing, shipping and delivery process. The conference, to be held at the Radisson Hotel O'Hare in Rosemont IL, includes 22 speakers, a carrier roundtable discussion, and over 35 exhibitors.

On Monday October 4th, Ed Church, Steve Pierce, and Bill Kipp of ISTA will present an all-day pre-conference tutorial entitled “Dock-to-Door: Limiting Parcel Package Transit Damage”. Attendees will learn the advantages of preshipment packaged-product testing in the laboratory and how it can help to control distribution damage and overall system costs.

ISTA Certified Packaging Laboratory Professional (CPLP) Workshops will be held October 5th & 6th in Countryside IL, about 13 miles from downtown Chicago. These Workshops are for people who want to become CPLP-certified, but prefer in-person classes to the usual self-study program. The Technician class will be held on Tuesday the 5th, followed by the Technologist class on Wednesday the 6th. You can attend one session or both – achieve Technician and Technologist certifications on consecutive days and under the same travel expense!

Each day will include presentation and discussion of the material, then a break, and finish with administration of the exam. Note: Only ISTA Members may take the CPLP exams and receive CPLP status.

An added bonus will be a Tuesday evening tour of the nearby UPS CACH (Chicago Area Consolidation Hub). This is a great chance to see packages going through one of the world's largest automated sorting facilities! Tour group size is limited, so register early.

Registration is $595 for each individual class, $1070 for one person taking both.

Click Here for complete information and to register for one or both Workshops.


The Fall Technical Committee Meeting is open to all  ISTA members, not just those on the Technical Committee, and is FREE! This is a great opportunity to participate in the ISTA technical process, and to network with other transport packaging professionals. In addition, there will be a tour of the UPS CACH (Chicago Area Consolidation Hub) during the morning extended break – tour size is limited, so register early.

The meeting will be held on Thursday, October 7th starting at 8 a.m., hosted by UPS Professional Services. Breakfast and lunch will be provided.

Agenda items to be covered include:
   • Update on ISTA Projects 3A, proposed Project 3B, Project 4AB, and the 4AB Data Depot
   • Resolution of existing technical and editorial changes to Procedures
   • Review of the new Test Procedure Development Plan and the Testing & Certification Committee
     Operating Process
   • Review of Test Procedure objectives from the ISTA long-term plan, including issues of
     consistency, test alternatives, random vibration, test series structure, and methodologies
     to address overpackaging
   • ISTA’s Product Line Extension Policy – problems, possible modifications, certification
     of standard packages
   • Other business

Click Here for complete information and to register for the meeting.

Dimensions.05 and Call for Papers

You have marked your calendars and are planning to attend Dimensions.05, right? If not – Do it Now!!  Also, if you’re interested in presenting a paper, contact ISTA immediately. The Deadline is September 24th.

We’re currently collecting abstracts for possible presentations at Dimensions.05, to be held March 8 through 11, 2005, at Walt Disney World in Orlando, FL. All packaging related topics are welcome, of course, but we’d be particularly interested in success stories or challenges related to package performance testing or cutting-edge technology. Please e-mail us with your name, organization, and a short abstract of your paper/presentation for consideration.

Test Procedure Revisions
A small correction has recently been made to the Shock Testing sections of Procedures 1E and 3E. Although minor, the correction could be quite important in certain specific testing situations.

Procedures 1E and 3E are for Unitized Loads. In the “Before You Begin Shock Testing” sections, there’s a “Caution” statement relating to rotational drop testing. Essentially, if the unit load is relatively narrow and has a high center of gravity, there is the possibility that it could tip over in some rotational drop test orientations. The “Caution” statement said that for these particular types of loads, it was permissible to test the longest edges only. This should read “shortest edges” instead.

The corrected Procedures are on-line. ISTA Members may LOGIN, go to “Procedure Search”, and download these corrected versions. Any of the other Test Projects or Procedures may be downloaded in the same way. Check the “Procedure Changes” section of the ISTA website for a list of the most recent changes.

Virginia Tech Offers Unit Load Design Short Course
Virginia Tech's Center for Unit Load Design is offering their popular short course September 22-24 in Blacksburg, VA.

During this 3-day class, attendees will learn proven methods to:
   • Lower unitization costs
   • Reduce product damage
   • Identify opportunities in warehouse audits
   • Increase material handling rates
   • Understand the perspective of packaging engineers, pallet suppliers, and equipment designers.
   • Learn Unit Load Design: the systems-based optimization procedures that will improve customer
     service and increase competitiveness

Included is an in-depth tour of the Center for Unit Load Design and Pallet Laboratory.

Click Here for complete information.

On September 13 at noon Eastern, Raymond Communications will present a teleconference on how to cope with new packaging requirements in Eastern Europe.

As the ten new Eastern European members of the European Union struggle to meet newly-mandated package recycling targets, exporters are facing a confusing set of taxes, fees, deposits and labeling requirements.

Top policy expert David Perchard will provide a complete overview of new and existing producer responsibility laws in the Eastern European countries during the teleconference. Slides will be sent to each participant beforehand, and there can be direct telephone interaction with the speaker during the conference.

Click Here for complete information.