| August
2007
The Symposium, to be held
September 25-26 in Shanghai, will present an outstanding line-up of
international speakers and educational topics. Leading organizations
will be showcasing their goods and services, and an optional CPLP Workshop,
business and sightseeing tour, and some golf will round out a most worthwhile
and enjoyable event.
The program includes topics such as package design and testing, test
procedure comparisons, packaging sustainability, advanced packaging
materials, test equipment selection, distribution environment measurement
studies (shock/impact, vibration, temperature), and more.
Thanks to all Symposium sponsors and exhibitors. The exhibits will be
open during dedicated times in the daily programs, and at an evening
buffet dinner and reception.
GOLD Sponsors/Exhibitors – these organizations
are sponsoring the Symposium at the highest level, and will also be
exhibiting. Click logos below to visit individual sponsors' websites.
SILVER
Sponsors/Exhibitors – these organizations are sponsoring the Symposium
and will also be exhibiting. Click logos below to visit individual sponsors'
websites.
OTHER
Exhibitors:
Sponsorship
and exhibiting opportunities are still available. Click
Here for the Symposium webpage and complete information.
On September 24, the day before the Symposium officially starts, optional
CPLP (Certified Packaging Laboratory Professional) Workshops will be
held. This is a fast and convenient way to achieve CPLP certification
with the help of an ISTA instructor. The Technician class will
be conducted by Han Xueshan of the China Packaging Research & Test
Center, while the Technologist class will be conducted by Bill
Kipp of ISTA. Click
Here for information on the CPLP Program.
Also on September 24, in the afternoon, a golf practice driving range
will be available at a nominal extra charge.
The day after the Symposium, September 27, there will be a free optional
business visit to the Dongling Vibration Test Instrument Co. in Suzhou.
After the company visit, attendees will be taken on a sightseeing tour
of the historic city of Suzhou, renowned for its beautiful stone bridges,
pagodas, and meticulously designed gardens.
Click
Here
for complete details on all aspects of the 2007 ISTA-China Packaging Symposium,
and to register.
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2008
Transport Packaging Forum – A New Great Event Presented by
ISTA
In
1996, ISTA presented our first educational and networking event
for the transport packaging community. Over the years ISTA’s
tradition of excellence in member and industry services has been
recognized worldwide. For 2008, ISTA will present a world-class
event, ISTA’s new International TRANSPORT PACKAGING
FORUM.
Scheduled for March 17-20, 2008 at Disney’s Coronado Springs
Resort in Florida, the Forum will reflect the excellence you expect
from ISTA. World-class speakers and presentations, exhibits from
leading companies in the field, a fabulous Welcome Reception, unsurpassed
networking, great food, enjoyable social activities, and an overall
experience you won’t want to miss!
Sponsorship and exhibiting opportunities are available. With a large
and focused audience, the Forum represents an excellent venue in
which to demonstrate your industry support and to present your organization’s
products and services. Click
Here to request more information.
A new website has been created at www.transportpackagingforum.com
with registration and hotel information. Please bookmark this site
and check often for program information and event updates.
If you are interested in becoming a Forum speaker, Click
Here to submit a title and abstract (200 words maximum) for
consideration. Don’t delay, as the program will fill up quickly.
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Project
4AB Program Changes, Availability
 
Project
4AB, ISTA’s web-based Enhanced Simulation test plan generator,
has been made more powerful and convenient in several key areas.
ISTA members are reminded that they still have free access to the
program through the end of 2007.
The most substantive change is in the way vibration test times and
levels are calculated. Previously, the program employed the maximum
permissible amount of time compression, which meant multiplying
field-measured levels by the maximum permissible factor. However
as we added vibration spectra from various regions of the world,
it became apparent that the calculated test spectra sometimes required
unreasonable displacements and accelerations. So a new algorithm
has been implemented. Now all vibration spectra will run on typical
test systems having 2.5 inches of stroke, with the test times adjusted
as necessary to achieve valid simulations.
A second series of drops was added to the single parcel test plans
for flat and elongated packages. This is the same change which was
recently made to Procedure 3A, to improve the simulation for those
specific package types. See the April
2007 issue of iNews for details.
For convenience, vibration top loads and compression test forces
are now rounded up to the nearest 5 lbs. The minimum required load
or force is now 25 lbs., and the vibration top loads for single
parcel testing have a maximum weight limit of 300 lbs.
Reference documents are now listed in appropriate sections of the
Test Plan. This gives more complete information to the operator,
in the lab, who is actually running the tests.
As announced with the release of Project 4AB version 1.0.0 in October
2006, access to the program is free to all ISTA members through
2007. Go to the Member
Login page of the ISTA website and click on “ISTA Project
4AB Test Planner”. Contact Bill
Kipp at ISTA if you have any questions or comments.
Non-members may contact ISTA members to have them demonstrate the
program and/or produce a Project 4AB test plan.
Click
Here for background and information on Project 4AB.
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ISTA
and UPS to Present Workshop at Parcel Forum
  Parcel
Forum 07 will be held October 29-31, 2007 at the Hyatt Regency O’Hare
in Chicago. This is the only event focused on the entire small-shipment
supply chain, from order entry to final delivery. ISTA and UPS will
collaborate to present a pre-conference workshop entitled “Packaging
That Works–And How to Achieve It”.
The workshop will discuss how to use laboratory tests to support
the design of packages which afford proper protection at reasonable
cost. Test approaches will focus on ISTA Procedure 3A, and examples
drawn from UPS’ and their clients' experiences will show the
do’s, don’ts, and basic principles of good package design.
A morning tour of the UPS Chicago Area Consolidation Hub (CACH)
will give attendees a great opportunity to see packages going through
one of the industry’s largest and most advanced automating
sorting facilities.
Click Here
for complete information on Parcel Forum 07.
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ISTA
at IAPRI
The International Association of Packaging Research Institutes is
a prestigious organization with members from universities, national
institutes, associations, research organizations, and commercial
enterprises engaged in packaging research and development. Their
23rd Symposium will be held this year in Windsor, UK Septermber 3-5, and ISTA will
be well represented.
Ed Church, ISTA Executive Director, will present “Developing
Temperature Controlled Environmental Test Standards”, describing
a project being undertaken by ISTA and the Pharmaceutical Cold Chain Interest
Group within the Parenteral Drug Association (PDA). The objective
is to make large-scale measurements of the temperatures and humidities
experienced by packages shipped throughout the U.S., and then translate
that data into industry-approved testing profiles.
Bill Kipp, ISTA Associate Executive Director, along with Olle Söderström
of the SCA R&D Center in Sweden, will present the results of
a two-year study of drops and impacts in the European express shipping
environment. Paul Russell of Hewlett-Packard (now with Applied Biosystems)
was also a key participant in this study.
Eric Joneson of Lansmont Corporation, ISTA’s Executive VP,
is also on the program, presenting “Developing a Random Vibration
Profile Standard”. And Paul Singh of Michigan State University,
ISTA’s VP of Testing & Certification, will also be there
in his official capacity as an IAPRI Board member.
For complete information on IAPRI and the Symposium, Click
Here.
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