| JANUARY
2004
Combined
Vibration and Altitude Test Being Added to Project 3A
The combination of vibration and low atmospheric
pressure can cause problems for airtight containers, even for those which
have successfully passed separate vibration and differential pressure
tests. This is the conclusion of Dr. Paul Singh’s Dimensions.02
presentation “Effects of High Altitude on Package Integrity”
and subsequent work.
Since ISTA Project 3A (see last
month’s iNews) is a new general simulation test for packaged-products
shipped through an air or ground parcel delivery system, it’s logical
that such a combined test should be included in 3A as an option. With
encouragement from the FAA, this work has been underway for some time
and will be posted on the Technical Committee section of the ISTA Discussion
Forum for your review and comment within the next few weeks. Contact Meredith
Young at ISTA headquarters if you’d like access to this section
of the Forum.
ISTA
Project 3B Being Planned
Just as Project 3A is a comprehensive test protocol for
parcel delivery system shipments, Project 3B is planned as a comprehensive
test for shipments by LTL motor freight.
The idea is for 3B to incorporate the latest information regarding shock
(equivalent drop heights and other impacts), random vibration spectra,
top loads, atmospheric conditions, etc. for “standard” and
“odd-shaped” packaged-products. Anyone interested in working
on this project, or having data/information on the LTL environment, is
encouraged to contact Ed
Church at ISTA headquarters.
Information
Needed – How Do Plastic Packages Perform Under Load?
When plastic packages are compressed (as when they’re
carrying all or part of the load in warehousing and storage), how does
their strength vary with time and temperature? Corrugated box strength
vs. time and humidity is well documented, but data on plastic packages
doesn’t seem to be as readily available. ISTA would like to have
such data for use in its testing protocols – particularly the upcoming
Project 4AB, where even fairly complicated relationships could be incorporated
into the program. If you have information or experience in this area,
please contact Bill
Kipp at ISTA.

ISTA and IoPP are currently providing links to an important new survey
of the product-manufacturing packaging community. The PkgIT Survey is
aimed at providing the packaging community with a window into the rapidly
changing technology landscape within which it functions. That change is
often not driven by the needs of packaging departments. Getting at the
complexity of this scenario and trying to discover common threads is what
this survey is about. Packaging is a horizontal discipline, and packaging
professionals can learn from each other across sectors.
So please take the survey.
The more participation in the survey, the more useful the data will be
to all of us. The survey takes about 15 minutes. Every participant will
receive the summarized results and the accompanying study after they are
presented at the Dimensions04 conference in April.
If you have many members in your packaging group or many divisions around
your company with packaging groups, get them all to take the survey. Companies
that request it will receive a detailed, confidential report of their
own company's responses. This can be useful for understanding the varying
needs and priorities around the extended enterprise. To request this option,
or for any other information, please contact the PkgIT Survey Team at
survey@gpkg.com.
Parcel
Forum Presentation Booklet Available
At the Parcel Shipping & Distribution Forum in Chicago last October,
attendees at the ISTA session were given color printouts of our Powerpoint
slides. A limited quantity of these booklets is available.
ISTA’s presentation was titled “Limiting In-Transit Damage:
The Do’s and Don’ts of Packaging”, and explained the
many aspects of ISTA testing and how it relates to transport packaging,
as well as detail on the application and benefits of ISTA education and
certification services. The printout booklets are 63 pages, full-color,
and spiral-bound. A limited number are available at $40 each, contact
Lisa
Sabala at ISTA headquarters if you’d like one.

Register
NOW to Get Early-Bird Discount
Register
for Dimensions.04 by January 30th and save roughly 10 percent off the
Conference Rate. Additional attendees from the same company earn a further
$100 discount. Click Here
for complete information.
Be Sure to Complete Your ENTIRE Registration Form
Be certain to indicate, on your Dimensions registration
form, which of the special events and sessions you and your guests would
like to attend. Don’t be disappointed at the last minute!
All registered Dimensions attendees are invited to the Welcome Reception
and Exhibitors Reception at no extra charge, but any guests must be signed
up and pay an additional fee. The Cold Chain Workshop and Lab Council
Meeting are free. “It’s a Family Thing” is free but
we must know how many people, particularly children, will attend. The
CPLP Workshop requires registration and payment of an additional fee.
And, as usual, sign-ups for golf are particularly limited. All of these
are on the registration form – please fill it out carefully! Click
Here to register.
Speaker
on Electronic Product Code Added to Dimensions.04 Program
Field trials are now getting underway for an emerging
technology that may potentially revolutionize the supply chain. Hear about
EPC at Dimensions.
Bud Babcock, Manager of Logistics Packaging and Product ID for Procter
& Gamble, is a recent addition to the Dimensions program to present
this fascinating and important subject. As Chairman of the EAN*UCC Physical
Technical Requirements Group, which governs global standards for Product
ID and Bar Coding, Bud is a leading proponent of EPC. Learn what trading
partners need to do to ensure successful launch and execution, and what
testing is required to ensure that EPC tags can survive the rigors of
transit.
Dimensions
Cold Chain Technology Workshop
If you’re concerned with the distribution
of temperature-sensitive shipments, don’t miss this workshop! To
be held Wednesday, April 14, from 9 a.m. to noon (prior to the official
start of the Dimensions program), the Cold Chain Management and Distribution
Workshop will be chaired by Larry Gordon of Cold Chain Technologies. Rich
Hollander of Pfizer will present findings of the USP Package, Storage,
and Distribution Expert Committee; Jeff Seeley of Merck will speak about
recent progress of the PDA Pharmaceutical Cold Chain Discussion Group;
and David Nelson of FedEx will review his company’s experience with
monitoring ambient temperatures of small parcel shipments.
There's no additional charge for Dimensions registrants to attend this
workshop, but please register (there’s a box on the registration
form) so that everyone can be accommodated.
Dimensions
Sponsorships Still Available
In addition to supporting Dimensions,
ISTA, and IoPP, your company can enjoy recognition and tangible benefits
by becoming a Dimensions.04 Sponsor. Four levels are available.
For complete details, Click
Here. All sponsors will receive recognition on the ISTA,
IoPP, and Dimensions websites, a listing and notice in the ISTA and IoPP
newsletters (read by over 6000 members), as well as signs and announcements
during the four-day forum. In addition, Gold Sponsors will receive one
free Exhibitor space, while Platinum Sponsors will receive an Exhibitor
space and a free conference registration!
Packaging
World Joins Dimensions as Media Partner

Packaging
World, with a circulation to nearly 100,000 packaging professionals
spread across all package-using industries, has become the exclusive Media
Partner for Dimensions.04.
Packaging World will be instrumental in promoting the Forum’s program
and events through its print publication, e-newsletters and website. Ed
Church and Ed Landon, ISTA and IoPP’s Executive Directors agree,
“We are very pleased with the relationship because the people who
read this leading publication are the very people who will be attending,
presenting and even exhibiting at Dimensions.04”. Visit the Packaging
World website, or come meet their representatives at Dimensions.
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