ISTA Gets Around
ISTA Staff
and Officers are always participating in industry-related shows, conferences,
technical meetings, and the like. But this last month or so has been
particularly busy with Packaging Services Expo, a Forest Products
Society seminar, Poly Pack, an ASTM meeting, and the NIPHLE Annual
Conference.
Packaging Services Expo
ISTA was a sponsor and exhibitor at Packaging Services Expo, held
in May at the Donald E. Stephens Convention Center in Rosemont, IL.
The ISTA booth was a gathering point for members (several of whom
participated in the show as exhibitors), and was visited by people
interested in learning how ISTA helps control costs, damage, and resources
during distribution.

ISTA
Secretary Leon Venech of SGS U.S. Testing (center, in brown shirt
and tie),
ISTA Executive Director Ed Church (2nd from
right), and Larry Dull of Syngenta
Crop Protection (to Leon’s right, ISTA VP-Operations and
IoPP President) help
representatives from sponsoring organizations and other dignitaries
cut the
ribbon to open Packaging Summit 2006.
Ed Church and Meredith Young of ISTA staff were on hand to promote
the Association and answer questions about our many programs. ISTA
also hosted a luncheon on Tuesday, where Joan Pierce of Colgate-Palmolive
(and ISTA's recently elected President) spoke to the attendees about
"The Logistics Side of the Equation".
Packaging Services Expo is a part of The Packaging Summit, which also
includes the Packaging Containers & Materials Expo and the Packaging
Summit Conference. Next year’s version will be held May 15-17,
2007, again in Rosemont. ISTA members interested in participating
should contact Show Director Angel Roloff at angel@pkgsummit.com.
Forest Products Society Seminar

Meredith
Young, ISTA Director of Member Services, ISTA Officers Dan Hill (ABF
Freight Systems) and Dennis Young (Dennis Young & Associates),
as well as ISTA member Suzanne Fisher of Herman Miller, recently spoke
at a seminar in East Lansing presented by the Great Lakes Section
of the Forest Products Society. The event, “Innovative Packaging
and Transportation of Wood”, focused on issues relevant to wood
products, especially furniture.
Over 40 people attended the seminar, some from as far away as North
Carolina. Case studies were presented and the basics of packaging
were discussed during the morning session. Meredith's presentation
consisted of a detailed review of testing procedures, especially those
dealing with furniture, and the best method for selecting that "Just
Right Test". Attendees were also treated to a tour of Michigan
State’s packaging laboratory facility in the afternoon.
PDF copies of Meredith's presentation are available by request —
Click
Here!
Poly Pack 2006
Bill
Armstrong of Sealed Air (ISTA Past President), ISTA Executive Director
Ed Church, Paul Russell of HP (ISTA Director), and Herb Schueneman
of San Jose State (ISTA Dave LeButt Award recipient), all spoke at
Poly Pack 2006. Poly Pack is a three-day packaging symposium which
brings industry together with education for learning and the exploring
of mutual opportunities.
ASTM D10 Meeting
The
fall meeting of ASTM International’s Committee D10 on Packaging
took place in Toronto last month, with ISTA Executive Director Ed
Church, Sealed Air’s Bill Armstrong (ISTA Past President), and
Paul Singh of Michigan State (ISTA VP of Testing & Certification)
in attendance. Subcommittee, task group, and other meetings were held
on a variety of issues; items of particular interest to ISTA members
included:
• Small Parcel Task Group Meeting
This effort continues, with
the meeting devoted to a detailed review of the current draft and
a
discussion of the drop heights
and impact orientations.
• Vibration Test Method, D 999
There was discussion that
the Repetitive Shock Tests of Methods A1 and A2 might be too
severe for large containers and
IBCs. It was suggested that the requirement to pass the
indicating shim under an entire
length of the package be changed to only a corner. This might
apply to all packages or only
to certain types of packages.
• ISO 4180 Revision
Apparently ISO (International
Organization for Standardization) is working on a revision to their
package performance test standard,
4180. A first draft document has been written.
• ASTM D 4169 Temperature Tolerance
D 4169, “Performance
Testing of Shipping Containers and Systems” requires a conditioning
temperature tolerance of ±
1° C. There was general agreement in the meeting that this is
a
difficult accuracy to achieve.
NIPHLE Conference
The National Institute of Packaging Handling and Logistics Engineers
(NIPHLE) held its 50th Anniversary Training Conference last week in
Baltimore. ISTA Dimensions.06 speakers Mike Bacior of FedEx Ground,
Eric Joneson of Lansmont (ISTA Executive VP), and Paul Singh of Michigan
State (ISTA VP of Testing and Certification) were on the program.
ISTA Executive Director Ed Church and Bill Armstrong of Sealed Air
(ISTA Past President) also attended. Congratulations to Paul Singh,
who received NIPHLE’s 2006 Achievement Award in Logistics.
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Project
3B Basic Test Elements Being Defined
The development of Project 3B, a new ISTA test to simulate the Less-Than-Truckload
(LTL) environment, is underway. The 3B Task Group has reviewed results
of a carrier survey, and is currently defining the basic test elements
to be included in the protocol.
The 3B Task Group board on the ISTA website Discussion Forum has been
very active, with members contributing a number of good comments and
suggestions. These include possible test variations to accommodate
flat or long packages and pallets, inclusion of concentrated impacts
and hazard drops/impacts, the advisability of horizontal and vertical
compression tests, effectiveness of lift truck handling tests, tip/tipover
considerations for tall and top-heavy packages, increased severity
edge drops, atmospheric conditioning, and other issues. Once all inputs
have been received and resolved, writing of a first draft can begin.
The 3B discussion board is only open to Task Group members. If you
have something to contribute or would like to be in the Group, contact
Meredith
Young at ISTA Headquarters.
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Promote
Your Company in the ISTA Booth at Pack Expo!


PackExpo, billed as “North America’s Most Complete Packaging
Show”, will be held October 29 - November 2, 2006, in Chicago,
IL. ISTA will be on hand with a booth again this year – and
we are offering a unique opportunity for our members to "exhibit
without being there" or to supplement their show presence.
ISTA has secured a 20' x 10' booth for this year’s show, and
we will be using the extra space to not only promote ISTA activities
and programs, but also to offer promotion to our laboratory and
supplier members. This is a great chance to target the over 50,000
attendees from every segment of packaging without the expense of
travel and exhibit space. If you're already exhibiting you can use
this chance to expand your visibility even more, as we'll publicize
your booth number and additional information for you! The ISTA booth,
located in the Packaging Education Pavilion, is situated in a high-traffic
location – right at the entrance to the North Hall and next
to the PackExpo.com informational booth.
Showcase your products and services to professionals that are looking
specifically for what you have to offer! For a nominal $350 fee
you will receive:
• Display of your company literature
in the booth
• Signage with your company
logo in color, company name, and website address – plus your
PackExpo booth number if your
company is at the show!
• Promotion in a targeted email
that will be sent to over 2,000 packaging professionals in
September (this email will
again show your company logo and link to your website)
• Promotion in the August and
September issues of iNews
To arrange your participation, please contact Meredith
Young at ISTA Headquarters.
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Register
Now for Packaging Summit Europe

Packaging
Summit Europe is dedicated to bringing brand owners, packaging services,
and materials companies together under one roof for a two day high
level conference and exhibition. To be held July 4 & 5 in Amsterdam,
the event focuses on contract packaging services across the entire
spectrum from product concepts through fulfillment and distribution.
The Summit features speakers from Europe’s leading organizations,
including Unilever, Beiersdorf AG, Avery Dennison, Nestlé,
Procter & Gamble, Cardinal Health, SCA Packaging Europe, Tetra
Pak, HP Speciality Printing Systems, and others. Over 20 exhibitors
will be displaying the latest in services, design, software, products,
components, and materials.
Click Here
for complete information and to register.
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Want
to be a Speaker at Dimensions.07?
No,
that headline is not a misprint. Sure, Dimensions.06 was held less
than two months ago, and Dimensions.07 is still over nine months
away – but obtaining outstanding presenters is so important
that the process is started very early.
Dimensions.07, The International Forum on Transport Packaging, will
be held March 27-30, 2007, at Disney’s Coronado Springs Resort
in Orlando, FL. This annual conference has become the most highly-regarded
and best-attended event of its type in the world. See last
month’s iNews for a brief wrap-up of the 2006 version.
If you have an interesting and informative topic related to transport
packaging, the transportation/distribution environment, product
protection, testing, packaging innovations, or related subjects
and would like to be a speaker, we want to hear from you! Contact
Lisa
Bonsignore at ISTA Headquarters and tell her you’d like
to be considered.
The 2006 speakers and topics are posted on the Dimensions website.
Click
Here for an idea of the range of subjects and areas of interest
which are appropriate.
Remember that all presentations must be strictly non-commercial
in nature. If your company has a product or service that you’d
like to promote, consider being a Dimensions exhibitor, it’s
an effective way to showcase your products or services to a very
targeted audience.
Check the Dimensions
website for basic information on Dimensions.07, for a great
2006 event photo gallery, and for the 2006 speakers, sponsors, and
exhibitors.
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