March 2005

Dimensions.05 — Fabulous!

Dimensions.05 is now history, with many saying this was the best one ever! From the Welcome Reception to the Keynote Speaker’s “strip tease” to the great line-up of presenters (including some excellent first-timers) to the closing show, the Forum seemed to include just the right mix of education, business, networking, food, and fun.
          
Many thanks from ISTA and IoPP to the Dimensions.05 sponsors:

    
Before the Forum’s official start, the Certified Packaging Laboratory Professional Workshop resulted in the issuance of 21 new CPLP certificates. Shown here are all the CPLPs (old & new) who were able to be at the awards ceremony photo op. Click Here for details about the CPLP program.


The Welcome Reception at Disney MGM Studios featured delicious desserts (including deep-fried peanut butter and jelly sandwiches!), a DJ, and unlimited rides on the Rock ‘N Roller Coaster and the Tower of Terror. Who rode the most times?


You definitely had to be there, but Dennis Young’s rousing keynote address and “wardrobe malfunction” were classic Dennis in terms of both insightful content and unique presentation.




Twenty-three speakers covered the gamut of topics from specific package designs and applications to broad discussions of new technologies and software. There was a particular emphasis on packaging and logistics issues in China, India, and Asia, as more and more companies are doing business in those areas.

As usual, the Exhibitor’s Reception featured great food and perfect opportunities for business and networking. This Dimensions set a record for the number of exhibitors at 41.

Attendees who stayed to the very last were treated to fine presentations by Jamie Stewart (Clamp Truck Simulation) and Sean Connolly (Shipping Efficiency). The closing video/slide show was terrific, and then – sadly – the Forum was over. See you next year!

A complete wrap-up, photo gallery, and much more will be available in a few weeks at www.dimensions-info.com (be patient as we post this information). Forum attendees will also be able to log in to download updates and additions to the presentations and other material. Check back often, as new items will be added over the next few weeks.  Attendees will receive an email next week with their login details.
          

John Clarke Receives the R. David LeButt Award
The sixth annual Dave LeButt award was presented to John Clarke of the Nelson Company during Dimensions.05. It is given in recognition of outstanding contributions to the continuing education and future of packaging.

John’s career has focused on the engineering, design, and application of pallets and unit loads. He’s a former Director of Virginia Tech’s Center for Unit Load Design, a Research Associate for the William H. Sardo Jr. Pallet and Container Research Laboratory, and is currently an instructor for Virginia Tech’s series of short courses relating to Unit Load Design. He’s a member of ISTA, the National Wooden Pallet & Container Association and the Materials Handling & Management Society, as well as a past member of IoPP and the Reusable Pallet & Container Coalition. John is a frequent author and speaker, and presented a very-popular “Pallets 101” at Dimensions.04 last year (re-printed in the 4th Quarter PST magazine). He has B.S. and M.S. degrees in Wood Science and Forest Products from Virginia Tech.




Shown here is John with the award plaque, flanked by Dimensions.05 co-chairs Susan Clarke Williams and Leon Venech, with previous recipients (L-R) Bill Kipp, Al McKinlay, Herb Schueneman, and Dennis Young. The 2003 recipient, Dr. Jorge Marcondes of Clemson University, passed away last year.




The award honors the life and work of Dave LeButt, a friend and colleague in the packaging community, ISTA officer, and key member of and mentor to the staff at Georgia-Pacific’s Technical Center in Norcross, Georgia. A large memorial plaque is on display in the lobby there that bears nameplates of previous recipients. Click Here for further information on Dave, the award, and the ISTA Foundation.
 

2005 Resource Book in the Mail
The 2005 ISTA Resource Book will be mailed next week, and all current members will be receiving their copies soon. For those who have not yet renewed their ISTA memberships, the Book will be sent as soon as payment is received.

Containing complete information on ISTA, its people, programs, certifications, education, resources, Test Procedures, and Certified Laboratories, the Resource Book is a must-have for anyone involved with transport packaging. For 2005, the Member Directory section has been removed and placed on-line. This streamlines the Book, makes it easier to use, and keeps the membership information current at all times. 
 

        

The “China Symposium” is only about two weeks away. It promises to be a major event for ISTA and our Chinese partner, IVY Management, with 8 U.S. speakers, 7 Chinese speakers, and participation by local government officials and dignitaries of the Chinese packaging industry.

The Symposium also includes table-top exhibits, a reception/banquet, and (optionally) a CPLP Technician-level Workshop. It should be a tremendous opportunity to promote the benefits of testing and ISTA membership to an important audience.

Pira International has recently joined the ranks of those who are sponsoring this important event. Other sponsors include FedEx, L.A.B. Equipment, Lansmont, Sealed Air, and SGS U.S. Testing. Our sincere thanks to these organizations for their support of the Symposium and the worldwide packaging community.

Symposium sponsors, with links to their websites:
                   

                                          


Click Here for complete information on the Symposium.
 

Universities Offering Short Courses and Seminars
In the coming months, educational opportunities in packaging and logistics will be offered by Virginia Tech, Clemson, and Cal Poly.

Virginia Tech’s Center for Unit Load Design will offer a new “Basic Corrugated Packaging & Unit Load Design” course March 30-31 and again October 26-27. Attendees will learn about the design, selection, and use of corrugated packaging; the interactions between packaging, pallets, and material handling equipment; and the effect of pallet design on box performance.

The popular “Unit Load Design Short Course” will be given April 26-28 and again September 27-29. The course is co-sponsored by NWPCA and ISTA, and will present systems-based optimization procedures to improve efficiency, customer service and competitiveness.

An “Advanced Pallet Design System Course” will be held November 16-18. It is intended for the experienced pallet designer, and will present advanced capabilities of the Pallet Design System software, and the design and performance of various types of pallets.

Click Here for complete information on all these Virginia Tech courses.

Clemson University is offering two packaging seminars, “Packaging Fundamentals ” June 7-9, and “Managing Packaging Development” on June 9-10. The first will provide a thorough overview of the basic principles needed by all sucessful packaging professionals and those who interact with the packaging industry.

The second seminar will provide participants with the skills to successfully develop packages and packaging systems to meet the requirements of the product, the distribution and use environments, the packaging materials, and packaging production systems.

Click Here for complete information on these Clemson seminars.

Cal Poly is offering two courses during its “Poly Pack” event in May. ISTA will hold a Certified Packaging Laboratory Professional (CPLP) Technician-level workshop on May 10, conducted by Chad Thompson of UPS, ISTA’s VP of Testing and Certification. This is the same Workshop that is so successful at Dimensions and at other times throughout the year. Applicants will receive study booklets in advance, then course material will be presented in the morning and early afternoon at Cal Poly, followed by the exam. Successful applicants will achieve CPLP-Technician certification.

The second seminar is on Electrostatic Discharge (ESD), presented by Bob Vermillion of RMV Technologies. To be held May 12, it will cover ESD design and packaging fundamentals, together with material protocols and the new ESD Packaging Test Methods per ANSI/ESD S.541-2003.

Click Here for complete information on the Poly Pack events.